A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability: Fid-Bau Portal

A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Zhang, X. P. / Shi, Y. W. / Ye, L. / Mai, Y.-W.

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A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Zhang, X. P. / Shi, Y. W. / Ye, L. / Mai, Y.-W.

A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Zhang, X. P. / Shi, Y. W. / Ye, L. / Mai, Y.-W.

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Document information

Title:

A Tin-based Composite Solder Reinforced by Nano-sized Particulates and its Soldering Ability

Contributors:

Zhang, X. P. (author) / Shi, Y. W. (author) / Ye, L. (author) / Mai, Y.-W. (author) / Ye, L. / Mai, Y. W. / Su, Z.

Conference:

4th, Asian-Australasian conference on composite materials; Composites technologies for 2020 ; 2004 ; University of Sydney

Published in:

Asian-Australasian conference on composite materials; Composites technologies for 2020 ; 645-650

PROCEEDINGS OF THE ASIAN-AUSTRALASIAN CONFERENCE ON COMPOSITE MATERIALS

Publication date:

2004-01-01

Size:

6 pages

ISBN:

1855738317

Type of media:

Conference paper

Type of material:

Language:

English

Keywords:

Composite materials , Composites technologies , ACCM

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