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Adhesive disbond detection using piezoelectric wafer active sensors [9437-28]
Adhesive disbond detection using piezoelectric wafer active sensors [9437-28]
Adhesive disbond detection using piezoelectric wafer active sensors [9437-28]
Structural health monitoring and inspection of advanced materials, aerospace, and civil infrastructure (Conference)
01.01.2015
9437 0S-9437 0S
Aufsatz (Konferenz)
Englisch
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