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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors [5394-09]
Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors [5394-09]
Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors [5394-09]
Cuc, A. (Autor:in) / Giurgiutiu, V. (Autor:in) / Kundu, Tribikram / International Society for Optical Engineering
Conference; 3rd, Health monitoring and smart nondestructive evaluation of structural and biological systems ; 2004 ; San Diego, CA
01.01.2004
12 pages
Aufsatz (Konferenz)
Englisch
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