Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Recent void shrinkage models and their applicability to diffusion bonding
Recent void shrinkage models and their applicability to diffusion bonding
Recent void shrinkage models and their applicability to diffusion bonding
Takahashi, Y. (Autor:in) / Inoue, K. (Autor:in)
01.01.1992
953 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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