Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal stress intensity factors for an interfacial crack on a cusp-type inclusion
Thermal stress intensity factors for an interfacial crack on a cusp-type inclusion
Thermal stress intensity factors for an interfacial crack on a cusp-type inclusion
Kang Yong Lee (Autor:in) / Yong Hoon Jang (Autor:in)
ENGINEERING FRACTURE MECHANICS ; 44 ; 459
01.01.1993
459 pages
Aufsatz (Zeitschrift)
Unbekannt
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