Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Boundary element analysis of thermal stress intensity factors for cusp crack in transient state
Boundary element analysis of thermal stress intensity factors for cusp crack in transient state
Boundary element analysis of thermal stress intensity factors for cusp crack in transient state
Kang Yong Lee (Autor:in) / Jeong Kyun Hong (Autor:in)
ENGINEERING FRACTURE MECHANICS ; 45 ; 309
01.01.1993
309 pages
Aufsatz (Zeitschrift)
Unbekannt
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