Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
An Application of Computer Image-processing and Filmy Replica Technique to the Copper Electroplating Method of Stress Analysis
An Application of Computer Image-processing and Filmy Replica Technique to the Copper Electroplating Method of Stress Analysis
An Application of Computer Image-processing and Filmy Replica Technique to the Copper Electroplating Method of Stress Analysis
Sugiura, M. (Autor:in) / Seika, M. (Autor:in)
EXPERIMENTAL TECHNIQUES ; 18 ; 33
01.01.1994
33 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
METHOD FOR SUPPORTING FILMY MEMBER AND SUPPORT STRUCTURE FOR FILMY MEMBER
| Europäisches Patentamt | 2019
An Application of Computer Image-processing and Film Replica Technique to a Nickel Foil Strain Gage
| British Library Online Contents | 1997
Filmy orientalne na polskich ekranach lat dwudziestych. Obcość wykreowana
| DOAJ | 2012