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A platform for research: civil engineering, architecture and urbanism
An Application of Computer Image-processing and Filmy Replica Technique to the Copper Electroplating Method of Stress Analysis
An Application of Computer Image-processing and Filmy Replica Technique to the Copper Electroplating Method of Stress Analysis
An Application of Computer Image-processing and Filmy Replica Technique to the Copper Electroplating Method of Stress Analysis
Sugiura, M. (author) / Seika, M. (author)
EXPERIMENTAL TECHNIQUES ; 18 ; 33
1994-01-01
33 pages
Article (Journal)
Unknown
DDC:
620.11
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