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Microstructural development during fatigue of copper foils 20-100 m thick
Microstructural development during fatigue of copper foils 20-100 m thick
Microstructural development during fatigue of copper foils 20-100 m thick
Judelewicz, M. (Autor:in) / Kuenzi, H. U. (Autor:in) / Merk, N. (Autor:in) / Ilschner, B. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 186 ; 135
01.01.1994
135 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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