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Microstructural development during fatigue of copper foils 20-100 m thick
Microstructural development during fatigue of copper foils 20-100 m thick
Microstructural development during fatigue of copper foils 20-100 m thick
Judelewicz, M. (author) / Kuenzi, H. U. (author) / Merk, N. (author) / Ilschner, B. (author)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 186 ; 135
1994-01-01
135 pages
Article (Journal)
Unknown
DDC:
620.11
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