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The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
Soliman, M. S. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 30 ; 1352
01.01.1995
1352 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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