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The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
The influence of stacking fault energy on the creep behaviour of Ni-Cu-solid-solution alloys at intermediate temperatures
Soliman, M. S. (author)
JOURNAL OF MATERIALS SCIENCE ; 30 ; 1352
1995-01-01
1352 pages
Article (Journal)
Unknown
DDC:
620.11
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