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Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints. Part 2: Hot postcuring improvement of UF particleboards and its temperature forecasting model
HOLZ ALS ROH UND WERKSTOFF ; 56 ; 393-401
01.01.1998
9 pages
Aufsatz (Zeitschrift)
Deutsch
DDC:
620.12
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