Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Hot postcuring improvement of MUF-bonded particleboards and its temperature forecasting model
HOLZ ALS ROH UND WERKSTOFF ; 58 ; 307-308
01.01.2000
2 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.12
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