Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Opinion: Avoiding the Pitfalls of Bid Packaging, Knockoffs, and Value Engineering
Opinion: Avoiding the Pitfalls of Bid Packaging, Knockoffs, and Value Engineering
Opinion: Avoiding the Pitfalls of Bid Packaging, Knockoffs, and Value Engineering
ARCHITECTURAL RECORD ; 187 ; 185-190
01.01.1999
6 pages
Aufsatz (Zeitschrift)
Englisch
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