A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Opinion: Avoiding the Pitfalls of Bid Packaging, Knockoffs, and Value Engineering
Opinion: Avoiding the Pitfalls of Bid Packaging, Knockoffs, and Value Engineering
Opinion: Avoiding the Pitfalls of Bid Packaging, Knockoffs, and Value Engineering
ARCHITECTURAL RECORD ; 187 ; 185-190
1999-01-01
6 pages
Article (Journal)
English
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