Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Gosz, M. (Autor:in) / Okyar, A.F. (Autor:in)
MECHANICS OF MATERIALS ; 31 ; 317-329
01.01.1999
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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