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Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Effect of diffusionally accommodated interfacial sliding on the stress and deformation in copper/polyimide high density interconnects
Gosz, M. (author) / Okyar, A.F. (author)
MECHANICS OF MATERIALS ; 31 ; 317-329
1999-01-01
13 pages
Article (Journal)
English
DDC:
620.11
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