Unambiguous detection of the adhesive failure of metal films in the microscratch test by waveform analysis of the friction signal: Fid-Bau Portal

Unambiguous detection of the adhesive failure of metal films in the microscratch test by waveform analysis of the friction signal

Baba, S. / Midorikawa, T. / Nakano, T.

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Unambiguous detection of the adhesive failure of metal films in the microscratch test by waveform analysis of the friction signal

Baba, S. / Midorikawa, T. / Nakano, T.

Unambiguous detection of the adhesive failure of metal films in the microscratch test by waveform analysis of the friction signal

Baba, S. / Midorikawa, T. / Nakano, T.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Unambiguous detection of the adhesive failure of metal films in the microscratch test by waveform analysis of the friction signal

Beteiligte:

Baba, S. (Autor:in) / Midorikawa, T. (Autor:in) / Nakano, T. (Autor:in)

Erschienen in:

APPLIED SURFACE SCIENCE ; 144 ; 344-349

Erscheinungsdatum:

01.01.1999

Format / Umfang:

6 pages

ISSN:

0169-4332

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 621.35

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