Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W
Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W
Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W
Kriese, M. D. (Autor:in) / Gerberich, W. W. (Autor:in) / Moody, N. R. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 14 ; 3019-3026
01.01.1999
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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