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Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals
Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals
Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals
Peralta, P. (Autor:in) / Czapka, A. (Autor:in) / Obergfell, K. (Autor:in) / Llanes, L. (Autor:in) / Laird, C. (Autor:in) / Mitchell, T.E. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 270 ; 349 - 353
01.01.1999
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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