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Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Peralta, P. / Czapka, A. / Obergfell, K. / Llanes, L. / Laird, C. / Mitchell, T.E.

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Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Peralta, P. / Czapka, A. / Obergfell, K. / Llanes, L. / Laird, C. / Mitchell, T.E.

Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Peralta, P. / Czapka, A. / Obergfell, K. / Llanes, L. / Laird, C. / Mitchell, T.E.

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Document information

Title:

Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Contributors:

Peralta, P. (author) / Czapka, A. (author) / Obergfell, K. (author) / Llanes, L. (author) / Laird, C. (author) / Mitchell, T.E. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 270 ; 349 - 353

Publication date:

1999-01-01

Size:

5 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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