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On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
Peng, X. K. (Autor:in) / Wuhrer, R. (Autor:in) / Heness, G. (Autor:in) / Yeung, W. Y. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 34 ; 2029-2038
01.01.1999
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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