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On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
On the interface development and fracture behaviour of roll bonded copper/aluminium metal laminates
Peng, X. K. (author) / Wuhrer, R. (author) / Heness, G. (author) / Yeung, W. Y. (author)
JOURNAL OF MATERIALS SCIENCE ; 34 ; 2029-2038
1999-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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