Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil
Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil
Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil
Tae Won Lee (Autor:in) / In Kyum Kim (Autor:in) / Chi Hwan Lee (Autor:in) / Jong Hoon Kim (Autor:in)
JOURNAL OF MATERIALS SCIENCE LETTERS ; 18 ; 1599-1602
01.01.1999
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Growth Behavior of Intermetallic Compound Layer in Multi-laminated Ti-Al Diffusion Couples
British Library Online Contents | 2005
|Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples
British Library Online Contents | 2006
|Prediction of formation of intermetallic compounds in diffusion couples
British Library Online Contents | 2007
|Compound growth in platinum/tin-lead solder diffusion couples
British Library Online Contents | 1996
|Study of Intermetallic Phase Transformations in 3xxx Alloys Using Diffusion Couples
British Library Online Contents | 2002
|