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    Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil

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    New search for: In Kyum Kim
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    Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil

    New search for: Tae Won Lee
    New search for: In Kyum Kim
    New search for: Chi Hwan Lee
    New search for: Jong Hoon Kim

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil

    New search for: Tae Won Lee
    New search for: In Kyum Kim
    New search for: Chi Hwan Lee
    New search for: Jong Hoon Kim

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Growth behavior of intermetallic compound layer in sandwich-type Ti/Al diffusion couples inserted with Al-Si-Mg alloy foil

    Contributors:

    Tae Won Lee (author) / In Kyum Kim (author) / Chi Hwan Lee (author) / Jong Hoon Kim (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE LETTERS ; 18 ; 1599-1602

    Publication date:

    1999-01-01

    Size:

    4 pages

    ISSN:

    0261-8028

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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