Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
Ig Hong, S. (Autor:in) / Hill, M. A. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 281 ; 189 - 197
01.01.2000
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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