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Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
Ig Hong, S. (author) / Hill, M. A. (author)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 281 ; 189 - 197
2000-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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