Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low temperature creep of nanocrystalline pure copper
Low temperature creep of nanocrystalline pure copper
Low temperature creep of nanocrystalline pure copper
Cai, B. (Autor:in) / Kong, Q. P. (Autor:in) / Lu, L. (Autor:in) / Lu, K. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 286 ; 188 - 192
01.01.2000
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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