Thermal-Elasto-Plastic Analysis of W-Cu Functionally Graded Materials Subjected to a Uniform Heat Flow by Micromechanical Model: Fid-Bau Portal

Thermal-Elasto-Plastic Analysis of W-Cu Functionally Graded Materials Subjected to a Uniform Heat Flow by Micromechanical Model

Ueda, S. / Gasik, M.

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Thermal-Elasto-Plastic Analysis of W-Cu Functionally Graded Materials Subjected to a Uniform Heat Flow by Micromechanical Model

Ueda, S. / Gasik, M.

Thermal-Elasto-Plastic Analysis of W-Cu Functionally Graded Materials Subjected to a Uniform Heat Flow by Micromechanical Model

Ueda, S. / Gasik, M.

Zugriff

Zugriff über TIB

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Bestellung bei Subito €

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Titel:

Thermal-Elasto-Plastic Analysis of W-Cu Functionally Graded Materials Subjected to a Uniform Heat Flow by Micromechanical Model

Beteiligte:

Ueda, S. (Autor:in) / Gasik, M. (Autor:in)

Erschienen in:

JOURNAL OF THERMAL STRESSES ; 23 ; 395-409

Erscheinungsdatum:

01.01.2000

Format / Umfang:

15 pages

ISSN:

0149-5739

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1121

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