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Elastoplastic Analysis of W-Cu Functionally Graded Materials Subjected to a Thermal Shock by Micromechanical Model
Ueda, S. (Autor:in)
JOURNAL OF THERMAL STRESSES ; 24 ; 631-650
01.01.2001
20 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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