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Enhancing the Adhesion of Copper Electroplates to Steel Substrates. I. Cyanide-Free Alkaline Baths
Enhancing the Adhesion of Copper Electroplates to Steel Substrates. I. Cyanide-Free Alkaline Baths
Enhancing the Adhesion of Copper Electroplates to Steel Substrates. I. Cyanide-Free Alkaline Baths
Gerasimenko, A. A. (Autor:in) / Krivoruchko, M. P. (Autor:in) / Korzhavina, V. V. (Autor:in)
PROTECTION OF METALS -NEW YORK- C/C OF ZASHCHITA METALLOV ; 36 ; 285-288
01.01.2000
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
669
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