A platform for research: civil engineering, architecture and urbanism
Enhancing the Adhesion of Copper Electroplates to Steel Substrates. I. Cyanide-Free Alkaline Baths
Enhancing the Adhesion of Copper Electroplates to Steel Substrates. I. Cyanide-Free Alkaline Baths
Enhancing the Adhesion of Copper Electroplates to Steel Substrates. I. Cyanide-Free Alkaline Baths
Gerasimenko, A. A. (author) / Krivoruchko, M. P. (author) / Korzhavina, V. V. (author)
PROTECTION OF METALS -NEW YORK- C/C OF ZASHCHITA METALLOV ; 36 ; 285-288
2000-01-01
4 pages
Article (Journal)
English
DDC:
669
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Copper Plating from Non-Cyanide Alkaline Baths
British Library Online Contents | 2014
|Alkaline Cyanide-Free Copper Electroplating of Steel
British Library Online Contents | 2003
|Effect of Ultrasonic on Copper Electroplating from the Non-Cyanide Alkaline Baths
British Library Online Contents | 2014
|Composite Nickel-Based Electroplates
British Library Online Contents | 2002
|British Library Online Contents | 1998
|