Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interface crack interacting with a microvoid in the near-tip process zone
Interface crack interacting with a microvoid in the near-tip process zone
Interface crack interacting with a microvoid in the near-tip process zone
Jian-Jun, H. (Autor:in) / Yi-Heng, C. (Autor:in)
INTERNATIONAL JOURNAL OF FRACTURE ; 102 ; 223-244
01.01.2000
22 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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