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Microstructural evolution, microhardness and thermal stability of HPT-processed Cu
Microstructural evolution, microhardness and thermal stability of HPT-processed Cu
Microstructural evolution, microhardness and thermal stability of HPT-processed Cu
Jiang, H. (Autor:in) / Zhu, Y. T. (Autor:in) / Butt, D. P. (Autor:in) / Alexandrov, I. V. (Autor:in) / Lowe, T. C. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 290 ; 128 - 138
01.01.2000
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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