Microstructural evolution, microhardness and thermal stability of HPT-processed Cu: Fid-Bau Portal

Microstructural evolution, microhardness and thermal stability of HPT-processed Cu

Jiang, H. / Zhu, Y. T. / Butt, D. P. / Alexandrov, I. V. / Lowe, T. C.

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Microstructural evolution, microhardness and thermal stability of HPT-processed Cu

Jiang, H. / Zhu, Y. T. / Butt, D. P. / Alexandrov, I. V. / Lowe, T. C.

Microstructural evolution, microhardness and thermal stability of HPT-processed Cu

Jiang, H. / Zhu, Y. T. / Butt, D. P. / Alexandrov, I. V. / Lowe, T. C.

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Check availability in my library

Order at Subito €

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Document information

Title:

Microstructural evolution, microhardness and thermal stability of HPT-processed Cu

Contributors:

Jiang, H. (author) / Zhu, Y. T. (author) / Butt, D. P. (author) / Alexandrov, I. V. (author) / Lowe, T. C. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 290 ; 128 - 138

Publication date:

2000-01-01

Size:

11 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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