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Analytical solution for bonded wedges under thermal stresses
Analytical solution for bonded wedges under thermal stresses
Analytical solution for bonded wedges under thermal stresses
Glushkov, E. V. (Autor:in) / Glushkova, N. V. (Autor:in) / Munz, D. (Autor:in) / Yang, Y. Y. (Autor:in)
INTERNATIONAL JOURNAL OF FRACTURE ; 106 ; 321-339
01.01.2000
19 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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