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Analytical solution for bonded wedges under thermal stresses

Glushkov, E. V. / Glushkova, N. V. / Munz, D. / Yang, Y. Y.

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Analytical solution for bonded wedges under thermal stresses

Glushkov, E. V. / Glushkova, N. V. / Munz, D. / Yang, Y. Y.

Analytical solution for bonded wedges under thermal stresses

Glushkov, E. V. / Glushkova, N. V. / Munz, D. / Yang, Y. Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Analytical solution for bonded wedges under thermal stresses

Contributors:

Glushkov, E. V. (author) / Glushkova, N. V. (author) / Munz, D. (author) / Yang, Y. Y. (author)

Published in:

INTERNATIONAL JOURNAL OF FRACTURE ; 106 ; 321-339

Publication date:

2000-01-01

Size:

19 pages

ISSN:

0376-9429

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1126

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