Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Lead-free flip chip bumping with special focus on stud bumping - a flexible and economical flip chip technology
Lead-free flip chip bumping with special focus on stud bumping - a flexible and economical flip chip technology
Lead-free flip chip bumping with special focus on stud bumping - a flexible and economical flip chip technology
Norlyng, S. (Autor:in)
ADVANCING MICROELECTRONICS ; 28 ; 28-32
01.01.2001
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Stud Bumping and Die Attach for Expanded Flip Chip Applications
| British Library Online Contents | 2004
A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps
| British Library Online Contents | 2007
Wafer Bumping Methods for Attaching Flip Chips Measure Up
| British Library Online Contents | 2003
Lead-free Solder Wafer Bumping
| British Library Online Contents | 2004
Solder Bumping - Mastering Challenges of Lead-free Alloys
| British Library Online Contents | 2005