Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Overview Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits
Overview Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits
Overview Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits
Keong, K. G. (Autor:in) / Sha, W. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 17 ; 1033-1038
01.01.2001
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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