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Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K
Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K
Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K
Yamamoto, Y. (Autor:in) / Uemura, S. (Autor:in) / Yoshida, K. (Autor:in) / Kajihara, M. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A -LAUSANNE- ; 333 ; 262 - 269
01.01.2002
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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