Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K: Fid-Bau Portal

Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K

Yamamoto, Y. / Uemura, S. / Yoshida, K. / Kajihara, M.

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Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K

Yamamoto, Y. / Uemura, S. / Yoshida, K. / Kajihara, M.

Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K

Yamamoto, Y. / Uemura, S. / Yoshida, K. / Kajihara, M.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Kinetic features of diffusion induced recrystallization in the Cu(Ni) system at 873 K

Contributors:

Yamamoto, Y. (author) / Uemura, S. (author) / Yoshida, K. (author) / Kajihara, M. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A -LAUSANNE- ; 333 ; 262 - 269

Publication date:

2002-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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