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Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects
Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects
Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects
Okolo, B. (Autor:in) / Lamparter, P. (Autor:in) / Welzel, U. (Autor:in) / Wagner, T. (Autor:in) / Mittemeijer, E. J. (Autor:in)
MATERIALS SCIENCE FORUM ; 404/407 ; 691-696
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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