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Formalin solution and acetone as organic additives in electrodeposition of copper
Formalin solution and acetone as organic additives in electrodeposition of copper
Formalin solution and acetone as organic additives in electrodeposition of copper
Soliman, H. M. (Autor:in)
APPLIED SURFACE SCIENCE ; 195 ; 155-165
01.01.2002
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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