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    Formalin solution and acetone as organic additives in electrodeposition of copper

    New search for: Soliman, H. M.

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    Formalin solution and acetone as organic additives in electrodeposition of copper

    New search for: Soliman, H. M.

    Access

    Access via TIB
    Check availability in my library
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    Formalin solution and acetone as organic additives in electrodeposition of copper

    New search for: Soliman, H. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Formalin solution and acetone as organic additives in electrodeposition of copper

    Contributors:

    Soliman, H. M. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 195 ; 155-165

    Publication date:

    2002-01-01

    Size:

    11 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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