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Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films
Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films
Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films
Louro, C. (Autor:in) / Teixeira-Dias, F. (Autor:in) / Menezes, L. F. (Autor:in) / Cavaleiro, A. (Autor:in) / Vieira, T.
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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