Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Molding Simulation Predicting voids and unbalanced mold flow
Molding Simulation Predicting voids and unbalanced mold flow
Molding Simulation Predicting voids and unbalanced mold flow
Lin, T. Y. (Autor:in)
ADVANCED PACKAGING ; 11 ; 23-26
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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