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Dimensional stability and thermal stress of 6061Al/SiC~w composite during thermal cycles
Dimensional stability and thermal stress of 6061Al/SiC~w composite during thermal cycles
Dimensional stability and thermal stress of 6061Al/SiC~w composite during thermal cycles
Jiang, C. H. (Autor:in) / Wu, J. S. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 18 ; 1458-1460
01.01.2002
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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