Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Materials for 3D Packaging of Electronic and Optoelectronic Systems
Materials for 3D Packaging of Electronic and Optoelectronic Systems
Materials for 3D Packaging of Electronic and Optoelectronic Systems
Ozguz, V. H. (Autor:in) / Yamaguchi, J. (Autor:in)
MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 28 ; 35-40
01.01.2003
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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