Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
PM materials for electronic packaging
PM materials for electronic packaging
PM materials for electronic packaging
Tiejun, W. (Autor:in) / Wuping, Z. (Autor:in) / Ning, X. (Autor:in)
PM TECHNOLOGY -CHINA- ; 23 ; 145-151
01.01.2005
7 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
669
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Advanced Electronic Packaging Materials
British Library Online Contents | 2005
|Materials for 3D Packaging of Electronic and Optoelectronic Systems
British Library Online Contents | 2003
|Cu-SiC~p Composites as Advanced Electronic Packaging Materials
British Library Online Contents | 2014
|Materials selection issues for high operating temperature (HOT) electronic packaging (invited)
British Library Conference Proceedings | 1998
|